IR6500 — 1250W Closed-Loop Infrared BGA Rework and Motherboard Chip Desoldering Station 110V
Engineered for laptop motherboard repair, GPU and CPU chip reballing, automotive electronic modules, and SMD rework, the IR6500 Infrared BGA Rework Station combines a 400W upper far-infrared heater with an 800W bottom preheating table. Closed-loop K-type thermocouple feedback and programmable 8-segment thermal profiles help prevent circuit board warping during lead-free and leaded BGA reflow.
- Dual-Zone 1250W Infrared Heating: Pairs a 3.15 in by 3.15 in 400W upper infrared heating head with a 7.09 in by 7.09 in 800W lower infrared preheating bed
- 8-Segment Programmable Reflow Profiles: Stores up to 10 customizable temperature curves with 8 ramp and soak segments for precise leaded and lead-free BGA soldering
- PC USB Software and Live Curve Plotting: Connects via USB to display live heating curves, log rework profiles, and calibrate thermocouple accuracy within 0.5 percent
- Anti-Warp Universal Circuit Board Fixture: Adjustable V-groove clamping table supports motherboards up to 15.7 in by 13.8 in securely during heating
- Built-In Cooling Fan: Integrated cross-flow cooling fan rapidly cools the circuit board after reflow completion
- Dimensions and Power: Measures 18.7 in by 18.9 in by 16.5 in, weighs 33.1 lbs, and runs on standard 110V 60Hz US power
